Thermal, power and performance aware design of 2D/3D system-on-chip (SOC) architectures
Team
 | Atienza Alonso David |
 | Costero Valero Luis Maria |
 | Huang Darong |
 | Medina Morillas Rafael |
Research Partners
 | IBM Research |
 | Huawei CloudBU |
Sources of Funding
| RECIPE H2020 |  |
| Eurolab4HPC |  |
| Nano-Tera |  |
| | New Version 3.1 Released! And a major stone is achieved with the 1500th download of 3D-ICE. Thanks to all the users for their trust and support! |
| | Project/Tool scope:3D-ICE stands for 3D Interlayer Cooling Emulator. It is a Linux based Thermal Emulator Library written in C, which can perform transient thermal analyses of vertically stacked 3D integrated circuits with inter-tier Microchannel Liquid Cooling. It is based on Compact Transient Thermal Modeling (CTTM) of solids and liquids. Click here full list of publications and documentation related to 3D-ICE. Also, check out our new FAQ page. |
Usage of 3D-ICE
3D-ICE is the result of a committment to build a thermal simulator for both 2D and 3D ICs that is uncomplicated, easy to use, simple to understand, and compact and light enough to run fast on computers using minimal resources. The primary intended users of 3D-ICE are VLSI designers, heat sink engineers, researchers and PhD students developing the next generation cooling solutions for ICs. 3D-ICE accepts the physical description of the 3D-IC stack in the form of a simple and straightforward netlist file called the “Stack Description File”. The thermal power distribution of the individual dies can be given to 3D-ICE using “Floorplan File”. Using this information, 3D-ICE performs the transient thermal analysis of the system. There are a myriad of functions available that enable the user to print a variety of thermal data such as thermal maps of individual dies, temperature evolution at a single floorplan element against time, etc.
The latest version of 3D-ICE (3D-ICE 3.1, released in early 2022 enhances 3D-ICE by adding the capability of plugging-in arbitrary plugging models written in equation-based mathematical languages such as Modelica. 3D-ICE 3.1 therefore supports simulation not only of interlayer liquid cooling for 3D-ICs, but also natural and forced air convection (regular heatsinks and heatsink plus fan), including the simulation of variable fan speed setups.
Sincerely,
3D-ICE Project Team
Who are we?: Meet the 3D-ICE team
PS: We are constantly looking out for your feedback and comments in our stive to improve 3D-ICE. Please read this page to find out how you can contact us.
Click here to download 3D-ICE
Please see the User Guide for information before installation.Contact the 3D-ICE Project Team
3D-ICE v3.1 Features Video
Additional videos
Related Publications
| REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal | |||||
| Medina Morillas, Rafael; Huang, Darong; Ansaloni, Giovanni; Zapater Sancho, Marina; Atienza Alonso, David | |||||
| 2023-10-18 | Conference Paper |  |  | ||
| 3D-ICE 3.0: efficient nonlinear MPSoC thermal simulation with pluggable heat sink models | |||||
| Terraneo, Federico; Leva, Alberto; Fornaciari, William; Zapater Sancho, Marina; Atienza Alonso, David | |||||
| 2021-04-19 | Transactions on Computer-Aided Design of Integrated Circuits and Systems | |  |  | |
| Dynamic Thermal Management with Proactive Fan Speed Control Through Reinforcement Learning | |||||
| Iranfar, Arman; Terraneo, Federico; Csordas, Gabor; Zapater Sancho, Marina; Fornaciari, William; Atienza Alonso, David | |||||
| 2020 | [Proceedings Design, Automation and Test in Europe Conference and Exhibition] | | | ||
| 3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs | |||||
| Sridhar, Arvind; Vincenzi, Alessandro; Atienza Alonso, David; Brunschwiler, Thomas | |||||
| 2014 | IEEE Transactions on Computers | | |||
| GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation | |||||
| Sabry, Mohamed M.; Sridhar, Arvind; Meng, Jie; Coskun, Ayse K.; Atienza, David | |||||
| 2013 | Ieee Transactions On Computer-Aided Design Of Integrated Circuits And Systems | | |||
| Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks | |||||
| Vincenzi, Alessandro; Sridhar, Arvind; Ruggiero, Martino; Atienza Alonso, David | |||||
| 2012 | Proceedings of the 22nd edition of Great lakes symposium on VLSI (GLSVLSI2012) | | |||
| Fast and Scalable Temperature-driven Floorplan Design in 3D MPSoCs | |||||
| Arnaldo, Ignacio; Vincenzi, Alessandro; Rodrigo, Ayala; Luis, José; Risco, José L.; Hidalgo, J. Ignacio; Ruggiero, Martino; Atienza Alonso, David | |||||
| 2012 | Proceedings of the 13th IEEE Latin American Test Workshop (LATW2012) | | |||
| EigenMaps: Algorithms for Optimal Thermal Maps Extraction and Sensor Placement on Multicore Processors | |||||
| Ranieri, Juri; Vincenzi, Alessandro; Chebira, Amina; Atienza Alonso, David; Vetterli, Martin | |||||
| 2012 | Proceedings of the 49th Design Automation Conference, DAC 2012 | ||||
| Thermal Balancing of Liquid-Cooled 3D-MPSoCs Using Channel Modulation | |||||
| Sabry, Mohamed M.; Sridhar, Arvind; Atienza Alonso, David | |||||
| 2012 | Proceedings of the IEEE/ACM 2012 Design Automation and Test in Europe conference (DATE) | | |||
| Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs | |||||
| Sridhar, Arvind; Vincenzi, Alessandro; Ruggiero, Martino; Atienza Alonso, David | |||||
| 2012 | IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems | | |||
| Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs | |||||
| Sridhar, Arvind; Vincenzi, Alessandro; Ruggiero, Martino; Atienza Alonso, David | |||||
| 2012 | IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems | | |||
| System-Level Thermal-Aware Design of 3D Multiprocessors with Inter-Tier Liquid Cooling | |||||
| Sridhar, Arvind; Sabry, Mohamed M.; Atienza Alonso, David | |||||
| 2011 | Proceedings of Therminic 2011 | | |||
| Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs | |||||
| Vincenzi, Alessandro; Sridhar, Arvind; Ruggiero, Martino; Atienza Alonso, David | |||||
| 2011 | Proceedigns of the IEEE International Symposium on Low Power Electronics and Design (ISLPED 2011) | | |||
| Towards Thermally-Aware Design of 3D MPSoCs with Inter-Tier Cooling | |||||
| Sabry, Mohamed; Sridhar, Arvind; Atienza Alonso, David; Temiz, Yuksel; Leblebici, Yusuf; Szczukiewicz, Sylwia; Borhani, Navid; Thome, John Richard; Brunschwiler, Thomas; Michel, Bruno | |||||
| 2011 | Proceedings of Design, Automation and Test in Europe (DATE) | | |||
| Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries | |||||
| Sridhar, Arvind; Vincenzi, Alessandro; Ruggiero, Martino; Brunschwiler, Thomas; Atienza Alonso, David | |||||
| 2010 | Proceedings of the 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC'10) | | |||
| 3D-ICE: Fast compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling | |||||
| Sridhar, Arvind; Vincenzi, Alessandro; Ruggiero, Martino; Brunschwiler, Thomas; Atienza Alonso, David | |||||
| 2010 | Proceedings of the 2010 International Conference on Computer-Aided Design (ICCAD 2010) | | |||