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Given the fast pace of research, very few scientific studies stand the test of time. Even rarer is a study that continues to influence research a decade after its first publication. That distinction goes to “3D-ICE: Fast Compact Transient Thermal Modeling for 3D ICs with Inter-Tier Liquid Cooling,” a paper presented at the IEEE/ACM International Conference on Computer-Aided Design (ICCAD) 2010 Conference. It has been selected as the winner of the prestigious ICCAD 2020 – Ten Year Retrospective Most Influential Paper Award , which is one the most prestigious given in the Electronic Design Automation (EDA) community about industrial and academic relevance of a technical paper.

One of the key researches in the domain of quantitative information flow (QIF) is to effectively estimate information leaks in a system in order to prevent adversarial attacks. Most existing approaches are based on the white-box approach. However, this approach is often impractical due to the size or complexity of its internals, or the presence of unknown factors. This and other challenges forced a shift in focus to investigate methods for measuring a system’s leakage in a black-box manner.

While scientists have successfully reduced the size and costs of electronic components, a major challenge faced by such tiny devices is the absence of an optimum thermal and energy management technology. To bridge that gap, Elison Matioli and his colleagues at EPFL’s Power and Wide-band-gap Electronics Research Laboratory (POWERlab) have developed a novel microchannel network that not only cools electronic components but also makes them energy efficient.