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DTSTART;TZID=Europe/Paris:20180618T080000
DTEND;TZID=Europe/Paris:20180619T170000
DTSTAMP:20230602T130140Z
CREATED:20230601T122754Z
LAST-MODIFIED:20230602T130140Z
UID:9272-1529308800-1529427600@ecocloud.epfl.ch
SUMMARY:EcoCloud Annual Event - 2018
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/ecocloud-annual-event-2018/
LOCATION:Lausanne Palace\, Rue du Grand-Chêne 7-9\, Lausanne\, 1002\, Switzerland
CATEGORIES:EcoCloud Annual Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/2018.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20190506T090000
DTEND;TZID=Europe/Paris:20230507T170000
DTSTAMP:20230602T123940Z
CREATED:20230601T122923Z
LAST-MODIFIED:20230602T123940Z
UID:9274-1557133200-1683478800@ecocloud.epfl.ch
SUMMARY:EcoCloud Annual Event - 2019
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/ecocloud-annual-event-2019/
LOCATION:Lausanne Palace\, Rue du Grand-Chêne 7-9\, Lausanne\, 1002\, Switzerland
CATEGORIES:EcoCloud Annual Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/ecocloud2019-e1685627384376.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20200505T080000
DTEND;TZID=Europe/Paris:20200506T170000
DTSTAMP:20230602T165637Z
CREATED:20230601T123059Z
LAST-MODIFIED:20230602T165637Z
UID:9276-1588665600-1588784400@ecocloud.epfl.ch
SUMMARY:EcoCloud Annual Event - 2020
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/ecocloud-annual-event-2020/
LOCATION:Lausanne Palace\, Rue du Grand-Chêne 7-9\, Lausanne\, 1002\, Switzerland
CATEGORIES:EcoCloud Annual Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/coronavirus-2.tmb-479v.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20210616T080000
DTEND;TZID=Europe/Paris:20210617T170000
DTSTAMP:20230602T165248Z
CREATED:20230601T123339Z
LAST-MODIFIED:20230602T165248Z
UID:9278-1623830400-1623949200@ecocloud.epfl.ch
SUMMARY:EcoCloud Annual Event - 2021
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/sustainability-days-2021-program/
LOCATION:SwissTech Convention Center\, Rue Louis Favre 2\, Ecublens\, EPFL\, 1024
CATEGORIES:EcoCloud Annual Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/2021event.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20220524T080000
DTEND;TZID=Europe/Paris:20220524T170000
DTSTAMP:20230605T152901Z
CREATED:20230601T123536Z
LAST-MODIFIED:20230605T152901Z
UID:9280-1653379200-1653411600@ecocloud.epfl.ch
SUMMARY:EcoCloud Annual Event - 2022
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/ecocloud-annual-event-2022/
LOCATION:Lausanne Palace\, Rue du Grand-Chêne 7-9\, Lausanne\, 1002\, Switzerland
CATEGORIES:EcoCloud Annual Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/2022-scaled.jpeg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20221123T120000
DTEND;TZID=Europe/Paris:20221123T140000
DTSTAMP:20230602T161239Z
CREATED:20230602T151713Z
LAST-MODIFIED:20230602T161239Z
UID:9365-1669204800-1669212000@ecocloud.epfl.ch
SUMMARY:Silicon device dependability: Sani Nassif
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/silicon-device-dependability-visiting-professor-sani-nassif/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/png:https://ecocloud.epfl.ch/wp-content/uploads/2023/02/montage-1024x742-1.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20230227T100000
DTEND;TZID=Europe/Paris:20230227T120000
DTSTAMP:20230605T074358Z
CREATED:20230605T073943Z
LAST-MODIFIED:20230605T074358Z
UID:9405-1677492000-1677499200@ecocloud.epfl.ch
SUMMARY:Can we automate integrated circuit design?
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/can-we-automate-integrated-circuit-design/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/jasoncong.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20230308T080000
DTEND;TZID=Europe/Paris:20230308T170000
DTSTAMP:20230605T084739Z
CREATED:20230602T153759Z
LAST-MODIFIED:20230605T084739Z
UID:9376-1678262400-1678294800@ecocloud.epfl.ch
SUMMARY:Engineering Industry Day 2023
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/engineering_industry_day_2023/
LOCATION:SwissTech Convention Center\, Rue Louis Favre 2\, Ecublens\, EPFL\, 1024
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/png:https://ecocloud.epfl.ch/wp-content/uploads/2023/03/IMG_2860-e1678782096483.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20230429
DTEND;VALUE=DATE:20230501
DTSTAMP:20230602T164147Z
CREATED:20230602T162643Z
LAST-MODIFIED:20230602T164147Z
UID:9384-1682726400-1682899199@ecocloud.epfl.ch
SUMMARY:IT for Sustainability and Sustainable IT: are both possible?
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/it-for-sustainability-and-sustainable-it-are-both-possible/
LOCATION:EPFL Rolex Learning Center\, EPFL\, Ecublens\, 1015\, Switzerland
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/05/IMG_3043-scaled.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20230601T120000
DTEND;TZID=Europe/Paris:20230601T140000
DTSTAMP:20230602T131702Z
CREATED:20230601T105107Z
LAST-MODIFIED:20230602T131702Z
UID:9258-1685620800-1685628000@ecocloud.epfl.ch
SUMMARY:Innovation for Energy-Efficient Deep Learning
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/innovation-for-energy-efficient-deep-learning/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/png:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/IMG_3218.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20230612T100000
DTEND;TZID=Europe/Paris:20230612T110000
DTSTAMP:20230605T081219Z
CREATED:20230605T080043Z
LAST-MODIFIED:20230605T081219Z
UID:9411-1686564000-1686567600@ecocloud.epfl.ch
SUMMARY:Computing Near Storage
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/computing-near-storage/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/arvind-e1685952141331.jpeg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20230830T080000
DTEND;TZID=Europe/Paris:20230901T170000
DTSTAMP:20230602T164254Z
CREATED:20230602T163926Z
LAST-MODIFIED:20230602T164254Z
UID:9394-1693382400-1693587600@ecocloud.epfl.ch
SUMMARY:Connecting Artificial Intelligence to Internet of Things
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/connecting-artificial-intelligence-to-internet-of-things/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/05/AdobeStock_207856512_cropped-002.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Moscow:20231010T083000
DTEND;TZID=Europe/Moscow:20231010T180000
DTSTAMP:20230905T062206Z
CREATED:20230601T123649Z
LAST-MODIFIED:20230905T062206Z
UID:9282-1696926600-1696960800@ecocloud.epfl.ch
SUMMARY:EcoCloud Annual Event - 2023
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/ecocloud-annual-event-2023/
LOCATION:Lausanne Palace\, Rue du Grand-Chêne 7-9\, Lausanne\, 1002\, Switzerland
CATEGORIES:EcoCloud Annual Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2022/04/sdh_lausanne_palace_overview_06.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20231201T120000
DTEND;TZID=Europe/Paris:20231201T140000
DTSTAMP:20240119T123138Z
CREATED:20231120T091159Z
LAST-MODIFIED:20240119T123138Z
UID:9948-1701432000-1701439200@ecocloud.epfl.ch
SUMMARY:X-Agora - the X-HEEP Exchange Space
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/x-agora-the-x-heep-exchange-space/
LOCATION:ELG123\, EPFL\, Switzerland
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/png:https://ecocloud.epfl.ch/wp-content/uploads/2023/11/x-agora.png
ORGANIZER;CN="Juan Sapriza":MAILTO:juan.sapriza@epfl.ch
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20240125T143000
DTEND;TZID=Europe/Paris:20240125T153000
DTSTAMP:20240205T172019Z
CREATED:20240117T102429Z
LAST-MODIFIED:20240205T172019Z
UID:10156-1706193000-1706196600@ecocloud.epfl.ch
SUMMARY:Oracle Labs Presentation & Tech Talk
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/oracle-labs-presentation-tech-talk/
LOCATION:INF328\, EPFL\, Switzerland
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2022/05/1280px-Oracle_Headquarters_Redwood_Shores-e1653895626857.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20240314
DTEND;VALUE=DATE:20240315
DTSTAMP:20240315T132023Z
CREATED:20240117T102636Z
LAST-MODIFIED:20240315T132023Z
UID:10159-1710374400-1710460799@ecocloud.epfl.ch
SUMMARY:EPFL Engineering Industry Day
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/epfl-engineering-industry-day-2024/
LOCATION:SwissTech Convention Center\, Rue Louis Favre 2\, Ecublens\, EPFL\, 1024
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2024/03/volkan_totem.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20240325
DTEND;VALUE=DATE:20240326
DTSTAMP:20240117T103312Z
CREATED:20240117T103236Z
LAST-MODIFIED:20240117T103312Z
UID:10161-1711324800-1711411199@ecocloud.epfl.ch
SUMMARY:Applied Machine Learning Day
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/applied-machine-learning-day/
LOCATION:SwissTech Convention Center\, Rue Louis Favre 2\, Ecublens\, EPFL\, 1024
ATTACH;FMTTYPE=image/png:https://ecocloud.epfl.ch/wp-content/uploads/2024/01/amld.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20240325
DTEND;VALUE=DATE:20240328
DTSTAMP:20240109T140538Z
CREATED:20240109T140434Z
LAST-MODIFIED:20240109T140538Z
UID:10117-1711324800-1711583999@ecocloud.epfl.ch
SUMMARY:X-HEEP Workshop: Enabling rapid and sustainable RISC-V based research using open source HW and SW
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/x-heep-date2024/
LOCATION:Palacio De Congresos\, Valencia\, Palacio De Congresos\, Valencia\, Spain
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/05/xheep-team.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20240418T120000
DTEND;TZID=Europe/Paris:20240418T133000
DTSTAMP:20240515T144749Z
CREATED:20240515T142536Z
LAST-MODIFIED:20240515T144749Z
UID:10419-1713441600-1713447000@ecocloud.epfl.ch
SUMMARY:Data Champions Lunch Talks
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/data-champions-lunch-talks/
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2024/05/datachampion.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20240624T090000
DTEND;TZID=Europe/Paris:20240624T133000
DTSTAMP:20240605T072802Z
CREATED:20240605T072520Z
LAST-MODIFIED:20240605T072802Z
UID:10442-1719219600-1719235800@ecocloud.epfl.ch
SUMMARY:AVP-CP Centers Day
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/avp-cp-centers-day/
LOCATION:Room BCH 2103 (CECAM)
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2024/06/avp.jpg
ORGANIZER;CN="Myriam Mercier":MAILTO:lalla.mercier-lamrani@epfl.ch
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20240830T110000
DTEND;TZID=Europe/Paris:20240830T123000
DTSTAMP:20240822T093511Z
CREATED:20240627T060810Z
LAST-MODIFIED:20240822T093511Z
UID:10468-1725015600-1725021000@ecocloud.epfl.ch
SUMMARY:Future Health: Harnessing Multimodal Data and GenAI for Health Promotion
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/future-health-harnessing-multimodal-data-and-genai-for-health-promotion/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2024/06/uci.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20241007T080000
DTEND;TZID=Europe/Paris:20241007T163000
DTSTAMP:20241006T071755Z
CREATED:20240624T092434Z
LAST-MODIFIED:20241006T071755Z
UID:10456-1728288000-1728318600@ecocloud.epfl.ch
SUMMARY:Swiss Federal Offices Day 2024
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/sfod2024/
LOCATION:EPFL Rolex Learning Center\, EPFL\, Ecublens\, 1015\, Switzerland
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2024/06/ronnie-schmutz-SuATc8TPrMQ-unsplash_mirror-1920x1080-1.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20241008
DTEND;VALUE=DATE:20241009
DTSTAMP:20241111T080412Z
CREATED:20240508T090437Z
LAST-MODIFIED:20241111T080412Z
UID:10376-1728345600-1728431999@ecocloud.epfl.ch
SUMMARY:EcoCloud Annual Event 2024
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/annual-event-2/
LOCATION:Lausanne Palace\, Rue du Grand-Chêne 7-9\, Lausanne\, 1002\, Switzerland
CATEGORIES:EcoCloud Annual Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2023/06/2022-scaled.jpeg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20250128T160000
DTEND;TZID=Europe/Paris:20250128T180000
DTSTAMP:20250122T142620Z
CREATED:20250122T142620Z
LAST-MODIFIED:20250122T142620Z
UID:11009-1738080000-1738087200@ecocloud.epfl.ch
SUMMARY:Designing Computer Systems under Sanctions and Sustainability
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/designing-computer-systems-under-sanctions-and-sustainability/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2025/01/princeton.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20250520T183000
DTEND;TZID=Europe/Paris:20250520T213000
DTSTAMP:20250515T094131Z
CREATED:20250515T094131Z
LAST-MODIFIED:20250515T094131Z
UID:11240-1747765800-1747776600@ecocloud.epfl.ch
SUMMARY:Exhibition Opening for Utop'IA
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/exhibition-opening-for-utopia/
LOCATION:EPFL Rolex Learning Center\, EPFL\, Ecublens\, 1015\, Switzerland
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2025/05/1108x622.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20250630T083000
DTEND;TZID=Europe/Paris:20250630T180000
DTSTAMP:20250520T134028Z
CREATED:20250520T133925Z
LAST-MODIFIED:20250520T134028Z
UID:11261-1751272200-1751306400@ecocloud.epfl.ch
SUMMARY:SwissChips: Fostering chip-design research in Switzerland
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/swisschips-fostering-chip-design-research-in-switzerland/
LOCATION:Landesmuseum\, Zurich\, Landesmuseum\, Zurich\, Switzerland
CATEGORIES:EcoCloud Connected Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2025/05/landesmuseum.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20250916T151500
DTEND;TZID=Europe/Paris:20250916T164500
DTSTAMP:20250910T140058Z
CREATED:20250910T135503Z
LAST-MODIFIED:20250910T140058Z
UID:11464-1758035700-1758041100@ecocloud.epfl.ch
SUMMARY:High-Level Synthesis for Accelerator Design: Current Trends and Emerging Directions
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/high-level-synthesis-for-accelerator-design-current-trends-and-emerging-directions/
LOCATION:ELA2\, EPFL
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2025/09/milan.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20250925T111500
DTEND;TZID=Europe/Paris:20250925T120000
DTSTAMP:20250915T153037Z
CREATED:20250915T123146Z
LAST-MODIFIED:20250915T153037Z
UID:11474-1758798900-1758801600@ecocloud.epfl.ch
SUMMARY:The Battle of the Interconnects: Scale-up vs. Scale-out
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/the-battle-of-the-interconnects-scale-up-vs-scale-out/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2025/09/huaweiCH.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20251008T080000
DTEND;TZID=Europe/Paris:20251008T170000
DTSTAMP:20250828T082826Z
CREATED:20250516T154120Z
LAST-MODIFIED:20250828T082826Z
UID:11257-1759910400-1759942800@ecocloud.epfl.ch
SUMMARY:EcoCloud Annual Event
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/ecocloud-annual-event/
LOCATION:Lausanne Palace\, Rue du Grand-Chêne 7-9\, Lausanne\, 1002\, Switzerland
CATEGORIES:EcoCloud Annual Event
ATTACH;FMTTYPE=image/webp:https://ecocloud.epfl.ch/wp-content/uploads/2024/09/palace.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20251104T111500
DTEND;TZID=Europe/Paris:20251104T140000
DTSTAMP:20251029T133312Z
CREATED:20251009T135512Z
LAST-MODIFIED:20251029T133312Z
UID:11570-1762254900-1762264800@ecocloud.epfl.ch
SUMMARY:Andrea Bonetti of Sony: AI for Chip Design
DESCRIPTION:We are happy to announce that Peter de Bock\, Vice President of Data Center Energy and Cooling at Eaton\, will visit the EcoCloud Center\, and give a seminar.\nThis talk will be followed by a standing lunch on the terrace of the BC building. \nAI data centers have crossed a threshold: we are no longer designing facilities\, but city‑scale energy systems that convert power into tokens\, and tokens into artificial intelligence. Rising rack densities\, shrinking deployment timelines\, and grid constraints demand a shift from enterprise design approaches to end‑to‑end energy stack optimization\, from grid interconnection and power conversion to compute delivery and thermal rejection. \nOn the power side\, three interdependent domains must scale together: IT distribution in the whitespace (480 V AC and emerging 800 V DC architectures)\, liquid cooling infrastructure where CDUs and high‑amperage busways become mission‑critical loads\, and centralized cooling plants where medium voltage enables efficient delivery of industrial-scale power. Physics governs these choices\, with current driving footprint and fault domains defining availability. \nOn the thermal side\, the primary efficiency lever is the temperature delivered to silicon. Advanced cold plate designs with low thermal resistance enable hot‑water cooling aligned with chip roadmaps\, reducing reliance on chillers and reframing performance around compute output per unit energy. Thermal resistance becomes the key architectural driver of system efficiency. \nAt scale\, resilience requires coordinated power quality\, ride‑through for cooling loads\, and digital control layers. The advantage lies in engineering the entire energy stack—unlocking step‑change gains in efficiency and availability. \nDr. Peter De Bock is Vice President of Data Center Energy and Cooling at Eaton\, where he is responsible for strategic technology in energy and cooling\, and plays a key role in the integration of Boyd Thermal. \nPreviously Peter served as a Program Director at the U.S. Department of Energy’s ARPA-E\, where he architected\, and managed the COOLERCHIPS program\, a breakthrough initiative establishing the technical foundation for hot‑water–cooled data centers\, collapsing cooling energy use from ~30–40% to single digits while enabling scalable AI infrastructure\, elimination of water use and improving heat reuse potential. \nHe also led the ASCEND program\, pioneering Megawatt class ultra-high power-density electric propulsion architectures that established new benchmarks for integrated motor\, drive\, and thermal system performance. \nPrior to ARPA-E\, he spent nearly two decades at General Electric Research as a principal engineer in thermosciences and platform leader for power and thermal management systems. \nHe holds a PhD in mechanical engineering from the University of Cincinnati and MSc degrees from the University of Warwick and the University of Twente\, and is an ASME Fellow\, IEEE Senior Member\, former chair of the ASME K-16 committee\, and an inventor on 68 patents and applications.
URL:https://ecocloud.epfl.ch/event/andrea-bonetti-of-sony-ai-for-chip-design/
LOCATION:BC420 – Computing Building of EPFL\, EPFL\, Ecublens\, Switzerland
CATEGORIES:EcoCloud Official Event
ATTACH;FMTTYPE=image/jpeg:https://ecocloud.epfl.ch/wp-content/uploads/2025/10/sonyAI.jpg
END:VEVENT
END:VCALENDAR